Multichip Module High Speed Testing
Quarterly progress rept. 1 Jul-30 Sep 1991
COLUMBIA UNIV NEW YORK DEPT OF ELECTRICAL ENGINEERING
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In collaboration with Allied Signal Inc., have investigated the ultrafast electro-optic response and sensitivity of a poled side chain polymer film by a femtosecond electro-optic sampling technique. A 760 fs rise-time electrical transient was observed corresponding to a 460 GHz bandwidth. The measurement was made in a high speed coplanar transmission line structure using the electro-optic polymer as the dielectric. This result has important implications for the use of electro-optic polymers for probing signals in multi- chip module interconnection circuits. A paper describing this work preprint enlcosed has been accepted for publication in Applied Physics Letters. A second area of activity during the past quarter has been the establishment of a new experimental facility which will be used for the high speed testing of materials and devices for applications to multichip modules.
- Electrooptical and Optoelectronic Devices