Accession Number:

ADA254825

Title:

Multichip Module High Speed Testing

Descriptive Note:

Quarterly progress rept. 1 Jul-30 Sep 1991

Corporate Author:

COLUMBIA UNIV NEW YORK DEPT OF ELECTRICAL ENGINEERING

Personal Author(s):

Report Date:

1991-09-30

Pagination or Media Count:

17.0

Abstract:

In collaboration with Allied Signal Inc., have investigated the ultrafast electro-optic response and sensitivity of a poled side chain polymer film by a femtosecond electro-optic sampling technique. A 760 fs rise-time electrical transient was observed corresponding to a 460 GHz bandwidth. The measurement was made in a high speed coplanar transmission line structure using the electro-optic polymer as the dielectric. This result has important implications for the use of electro-optic polymers for probing signals in multi- chip module interconnection circuits. A paper describing this work preprint enlcosed has been accepted for publication in Applied Physics Letters. A second area of activity during the past quarter has been the establishment of a new experimental facility which will be used for the high speed testing of materials and devices for applications to multichip modules.

Subject Categories:

  • Electrooptical and Optoelectronic Devices

Distribution Statement:

APPROVED FOR PUBLIC RELEASE