Accession Number:
ADA254635
Title:
An Investigation of Residual Stresses in Machined Silicon Nitride
Descriptive Note:
Final rept.
Corporate Author:
ARMY LAB COMMAND WATERTOWN MA MATERIAL TECHNOLOGY LAB
Personal Author(s):
Report Date:
1992-07-01
Pagination or Media Count:
25.0
Abstract:
An X-ray diffraction XRD residual stress investigation was conducted on groups of machined silicon nitride specimens utilizing copper K alpha radiation, the 323 0-phase crystallographic planes and the sin2 psi stress-measuring technique. Cylindrical button-head tensile specimens formed by different processes and finish machined by different shops were characterized both before and after heat treatment. Surface machining stresses were also determined on a partial-machined tensile rod and on fractured flexure bars. The residual stress results are presented in the form of a comparative evaluation of processing parameters. Supplemental integrated intensity data from measurements on the partial-machined tensile rod and crushed buttonhead powder samples has demonstrated that XRD residual stress analysis may be applicable as a quality assurance procedure.
Descriptors:
- *STRESS ANALYSIS
- *MACHINING
- *HEAT TREATMENT
- *SILICON NITRIDES
- *RESIDUAL STRESS
- STRESSES
- LAYERS
- POWDERS
- X RAY DIFFRACTION
- X RAYS
- SURFACES
- QUALITY ASSURANCE
- RODS
- WIDTH
- SILICON
- COPPER
- RESIDUALS
- DIFFRACTION
- QUALITY
- CERAMIC MATERIALS
- FINISHES
- HEAT
- PHASE
- NITRIDES
- INTENSITY
- PROCESSING
- PARAMETERS
- MEASUREMENT
- RADIATION
Subject Categories:
- Inorganic Chemistry
- Ceramics, Refractories and Glass
- Mechanics