Double-Sided Wafer Alignment Techniques
Final rept. 17 Oct 1990-1 Feb 1991,
HARRY DIAMOND LABS ADELPHI MD
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A project was undertaken by the Harry Diamond Laboratories to develop a double-sided wafer alignment technique by which special-purpose devices could be fabricated using in-house equipment. The approach developed was inexpensive and did not require infrared alignment methods for viewing through the wafer. A double-sided alignment technique with two different accuracies was developed for use on an ordinary optical mask aligner. These methods were highly successful and are in active use today.
- Manufacturing and Industrial Engineering and Control of Production Systems
- Electricity and Magnetism
- Solid State Physics