Accession Number:

ADA250757

Title:

Double-Sided Wafer Alignment Techniques

Descriptive Note:

Final rept. 17 Oct 1990-1 Feb 1991,

Corporate Author:

HARRY DIAMOND LABS ADELPHI MD

Personal Author(s):

Report Date:

1992-04-01

Pagination or Media Count:

14.0

Abstract:

A project was undertaken by the Harry Diamond Laboratories to develop a double-sided wafer alignment technique by which special-purpose devices could be fabricated using in-house equipment. The approach developed was inexpensive and did not require infrared alignment methods for viewing through the wafer. A double-sided alignment technique with two different accuracies was developed for use on an ordinary optical mask aligner. These methods were highly successful and are in active use today.

Subject Categories:

  • Manufacturing and Industrial Engineering and Control of Production Systems
  • Electricity and Magnetism
  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE