Accession Number:

ADA250564

Title:

Dynamic Solder Management

Descriptive Note:

Interim rept. Dec 1991-Feb 1992

Corporate Author:

NAPIER POLYTECHNIC EDINBURGH (UNITED KINGDOM)

Personal Author(s):

Report Date:

1992-02-01

Pagination or Media Count:

13.0

Abstract:

Results from initial 2D steady-state isothermal simulations of wave soldering of DSM modified PCBs are presented. The effects of small 2mm obstacles on solder flow paths can be clearly seen, more sophisticated, realistic models are under development and will be reported next quarter.

Subject Categories:

  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE