Accession Number:

ADA250045

Title:

The Prediction of the Performance of a Microcircuit Heat Sink in the Boiling Mode

Descriptive Note:

Master's thesis

Corporate Author:

NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s):

Report Date:

1992-03-01

Pagination or Media Count:

61.0

Abstract:

As microcircuit technology advances, there is an increased need for the dissipation of the heat which is generated. Extended surfaces are a useful tool in fulfilling the heat sink requirements for a microcircuit element. Heat transfer is very effective in the boiling mode and this thesis focuses on the analysis of a spine-shaped extended surface in a boiling liquid. Because the heat transfer in the spine and the propagation of signals on a transmission line are governed by identical differential equations, an analysis procedure based on the cascading of electrical transmission lines is used to predict the performance of the spine. The result of the analysis is a computer program that can assist the circuit designer in meeting any heat transfer requirements. Spine Fin Extended Surface, Heat Sink.

Subject Categories:

  • Electrical and Electronic Equipment
  • Air Conditioning, Heating, Lighting and Ventilating
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE