Accession Number:

ADA243160

Title:

Computer Aided Thermal Analysis of a Microcircuit Structure

Descriptive Note:

Master's thesis,

Corporate Author:

NAVAL POSTGRADUATE SCHOOL MONTEREY CA

Personal Author(s):

Report Date:

1990-12-01

Pagination or Media Count:

65.0

Abstract:

The Naval Post Graduate School has obtained software which can be used for the thermal analysis of an electronic component. This software includes two versions, one for steady state analysis and the other for transient analysis. Each version consists of two programs, a model builder and a thermal analyzer. This thesis describes a user friendly, menu driven specific model builder which may be used to rapidly generate a thermal model, containing up to 750 nodes, for a microcircuit die. This model builder is an improvement over the existing model builder in that the only pertinent input will be the physical dimensions and heat transfer data. The main feature of this model builder is the accommodation of the marked variation of silicon thermal conductivity with temperature.

Subject Categories:

  • Electrical and Electronic Equipment
  • Computer Programming and Software
  • Thermodynamics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE