Accession Number:

ADA242927

Title:

Applicability of Superconducting Interconnection Technology for High Speed ICs and Systems

Descriptive Note:

Quarterly rept. (Final)

Corporate Author:

QUAD DESIGN TECHNOLOGY INC CAMARILLO CA

Personal Author(s):

Report Date:

1991-10-01

Pagination or Media Count:

132.0

Abstract:

The studies and analysis discussed in the quarterly reports on the program indicate that there are strong advantages for the use of high temperature superconductors for the signal interconnections in large, very high density 2-dimensional multi-chip modules of the types illustrated. MCMs is described in detail an analysis of the number of signal interconnect layers versus MCM size for maximal density surface tiled width IC chips with minimal spacing between them square MCMs. The comparison, between room temperature copper and HTSC interconnect materials, is based on a number of assumptions described in detail in that section. The assumptions include 1 chip IO counts determined from Rents rule as published by IBM for high performance chips eg.370 IOs for a 10,000 gate chip, taken to be 0.6 cm square, 2 average wire lengths from Donath model with Rents rule exponent of p 23, 3 a conductor width of W, a thickness of W2 and spacing of 3W, where W is the same for all conductors and selected to meet line resistance limitations, 4 a 40 utilization of theoretical channel space by actual interconnects 40 wiring efficiency, and 5 the longest line does not exceed two times the MCM size ie., corner to corner line with Manhattan wiring with no wrong way routing.

Subject Categories:

  • Electrical and Electronic Equipment
  • Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE