Accession Number:

ADA238704

Title:

New Ultra Low Permittivity Composites for Use in Ceramic Packaging of Ga:As Integrated Circuits

Descriptive Note:

Final rept. 1 Aug 1984-31 Jul 1987

Corporate Author:

PENNSYLVANIA STATE UNIV UNIVERSITY PARK MATERIALS RESEARCH LAB

Personal Author(s):

Report Date:

1991-07-12

Pagination or Media Count:

81.0

Abstract:

This report documents the work that has been conducted at the Materials Research Laboratory MRL, The Pennsylvania State University and Interamics in La Jolla, California, for the low permittivity project. The emphasis was on developing ultralow permittivity K substrate materials. Sol gel and reactive sputter deposited substrates were selected for further development into a viable substrate. Currently emphasis has shifted from development of ultra-low permittivity materials to putting down metallization on these low K substrates. Thus progress is being made in the direction of a prototype package which would utilize these substrates. This report starts off with the work done on the development of low K substrates and then moves on to the efforts on putting down metal traces and forming vias.

Subject Categories:

  • Electrical and Electronic Equipment
  • Ceramics, Refractories and Glass
  • Laminates and Composite Materials
  • Electricity and Magnetism

Distribution Statement:

APPROVED FOR PUBLIC RELEASE