Accession Number:

ADA238400

Title:

Comparison between the Interfacial Chemistry of Metallized Polyimides and Polymide Films on Bulk Metal Substrates

Descriptive Note:

Technical rept. no. 19, 6 Jan 1990-31 May 1991

Corporate Author:

MAINE UNIV AT ORONO LAB FOR SURFACE SCIENCE AND TECHNOLOGY

Report Date:

1991-05-31

Pagination or Media Count:

14.0

Abstract:

In this short overview the pertinent differences in the chemical interactions of differently prepared polymidemetal interfaces are summarized. Considered are the cases for metals deposited onto cured polyimide surfaces, interfaces prepared by spin coating polyamic acid onto bulk substrates and subsequent thermal imidization Cu, vapor deposited polyamic acid with subsequent thermal imidization Cu, Ag, Si, Cr, and deposition of polyamic acid in the form of mono- and multilayers by Langmuir Blodgett LB techniques onto a silicon 100 surface. New FTIR and XPS data are presented for copper deposition onto polyimide suggesting that initial interaction leads to elimination of carbon monoxide molecules from the polymer surface. Aromatic linear polyimides are a class of organic polymers with favourable mechanical properties and dielectric properties for application in electronic devices which can easily be processed into planar films. Today they are used routinely in VSLI devices as multilevel dielectric insulation.

Subject Categories:

  • Physical Chemistry
  • Electrical and Electronic Equipment
  • Laminates and Composite Materials

Distribution Statement:

APPROVED FOR PUBLIC RELEASE