Properties and Adhesion of Polyimides in Microelectronic Devices
Technical rept. 1 Jun 90-31 May 91,
MAINE UNIV AT ORONO LAB FOR SURFACE SCIENCE AND TECHNOLOGY
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This paper gives a summary on the properties of polyimide films used in microelectronic devices and on recent research efforts to understand the adhesion between polyimides and inorganic materials. One of the major concerns in the application of polyimides is the integrity and reliability of the laminar structures. Surface sensitive spectroscopies have been recently applied to identify the nature of the chemical bond for metals evaporated onto cured polyimide surfaces and for spun-on and subsequently imidized polyamic acid films on metal surfaces. Depending on the preparation of the interface, e.g. metal on polymer or polymer on bulk metal, different phenomena are observed.