Effect of Excess Oxydianiline on the Properties of Polyimide
Technical rept. 1 Jun 90-31 May 91,
MAINE UNIV AT ORONO LAB FOR SURFACE SCIENCE AND TECHNOLOGY
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Thin films of the polymer polyimide PI can be grown in ultra-high vacuum by codeposition of pyromellitic dianhydride PMDA and oxydianiline ODA. Raman spectroscopy was used to characterise the effects of non-stoichiometric deposition rates and substrate temperature on the chemical properties of the resulting PI film. Low fluxes and excess PMDA yield PI formation. High fluxes and excess PMDA thus ruling out the possibility of a one step process for PI formation. Defects that develop during processing of the polymer polyimide can adversely alter the dielectric properties and adhesion of polyimide thin films which are widely used, for semiconductors. Polyimide films can be cast or spin coated from solution or formed by direct vapor deposition.
- Polymer Chemistry
- Solid State Physics