Accession Number:

ADA237412

Title:

Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study. Version 2

Descriptive Note:

Final rept. Oct 90-Mar 91,

Corporate Author:

TEXAS INSTRUMENTS INC DALLAS

Personal Author(s):

• Mowatt, Larry
• Henry, Frank
• Avery, Mark
• Sadler, Porter
• Eskew, Mark

Report Date:

1991-04-08

Pagination or Media Count:

244.0

Abstract:

MCM technology is crucial to maintaining the competitive position of the U.S. electronics industry - military and commercial. The driving force is performance, and MCM users will seek off-shore suppliers if capabilities are lacking. In the long term, low-cost overseas capabilities will make their way into the U.S. military market and put it at risk. The proven GE-HDI MCM technology was developed with combined government and Ge funding, and its chips first approach offers the lowest non-recurring cost. Rapid prototyping, high performance, and technology flexibility are characteristic, and the potential exists for extension to high-volume.

Descriptors:

• *MARKETING
• LOW COSTS
• CHIPS(ELECTRONICS)
• MODULAR CONSTRUCTION
• COSTS
• ELECTRONICS INDUSTRY
• PACKAGING
• WAFERS
• FOUNDRIES
• FORCE(MECHANICS)
• OVERSEAS
• RISK
• SILICON

Subject Categories:

• Electrical and Electronic Equipment
• Solid State Physics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE