Accession Number:

ADA235223

Title:

Investigation of Polybenzocyclobutene Resins in Multilayer Thin Films for Electronic Packaging

Descriptive Note:

Final rept. Jan 1989-Sep 1990

Corporate Author:

WRIGHT RESEARCH AND DEVELOPMENT CENTER WRIGHT-PATTERSON AFB OH ELECTRO-OPTICSBRANCH

Personal Author(s):

Report Date:

1991-02-01

Pagination or Media Count:

57.0

Abstract:

Polybenzocyclobutene dielectric films were found to exhibit significant advantages compared to polyimides for multichip multilayer packaging applications. Although PBCB films must be cured in an oxygen-free environment and are somewhat more sensitive to warpagestress than polyimides, they are significantly superior with respect to moisture resistance, lower dielectric constant and leveling or planarization over rough surface topography. The adhesion of PBCB films to copper, aluminum and silicon without adhesion promoters is excellent. Tests to date with PBCB as a multilevel dielectric with both a counterdecoder circuit and an analog circuit, in conjunction with via post interconnects, reveal the potential for the reliable fabrication of high speed and high density multichipmultilayer modules.

Subject Categories:

  • Laminates and Composite Materials
  • Electricity and Magnetism

Distribution Statement:

APPROVED FOR PUBLIC RELEASE