Accession Number:

ADA232336

Title:

Fundamental Studies of Electronic Packaging Materials and Structures: Surface and Interfaces

Descriptive Note:

Final rept.

Corporate Author:

CORNELL UNIV ITHACA NY DEPT OF MATERIALS SCIENCE AND ENGINEERING

Report Date:

1990-12-12

Pagination or Media Count:

27.0

Abstract:

Layered structures consisting of metals, ceramics and polymers are used extensively for signal and power distribution both at the chip level and in electronic packages. The structural integrity of the interfaces between layers in such structures is an important consideration in the design and fabrication of a variety of devices and components. Various variables including surface composition and structure that control interfacial adhesion are investigated. Interfaces between metalceramic, metalpolymer and between polymerpolymer are studied in the research reported.

Subject Categories:

  • Containers and Packaging

Distribution Statement:

APPROVED FOR PUBLIC RELEASE