Fundamental Studies of Electronic Packaging Materials and Structures: Surface and Interfaces
CORNELL UNIV ITHACA NY DEPT OF MATERIALS SCIENCE AND ENGINEERING
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Layered structures consisting of metals, ceramics and polymers are used extensively for signal and power distribution both at the chip level and in electronic packages. The structural integrity of the interfaces between layers in such structures is an important consideration in the design and fabrication of a variety of devices and components. Various variables including surface composition and structure that control interfacial adhesion are investigated. Interfaces between metalceramic, metalpolymer and between polymerpolymer are studied in the research reported.
- Containers and Packaging