Investigation of a Tapered Artery Micro Heat Pipe for Cooling Ceramic Chip Carriers
Final rept. Jan 1989-Feb 1990
TEXAS A AND M UNIV COLLEGE STATION DEPT OF MECHANICAL ENGINEERING
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This investigation included several major tasks including the expansion of the existing analytical model to predict transient performance, determine the effect of variations in the size, and optimize the cross-sectional shape. In addition, several micro heat pipes which utilized this optimized shape were evaluated experimentally to determine their suitability for removing heat from a ceramic chip carrier. The result was an experimentally verified transient numerical model capable of predicting the onset of dryout in a tapered micro heat pipe during startup or variations in the evaporator thermal load was developed. Comparison of the numerical and experimental results indicate that the numerical model is capable of accurately predicting the maximum transport capacity prior to the onset of dryout, the temperature distribution throughout the longitudinal position, and the temperature difference between different locations on the heat pipe to within 0.3 C prior to the onset of dryout. In addition, the transient model was found to be capable of predicting the operation and temperature distribution of the tapered micro heat pipe to within or - 12 over a wide range of powers and operating temperatures.
- Air Conditioning, Heating, Lighting and Ventilating