Accession Number:

ADA224151

Title:

Smart Microsensors for High Temperature Applications. Phase 1

Descriptive Note:

Final rept. Aug 1989-Feb 1990

Corporate Author:

KOPIN CORP TAUNTON MA

Personal Author(s):

Report Date:

1990-06-28

Pagination or Media Count:

30.0

Abstract:

Microsensors find applications in many important areas of U.S. military hardware. Advances in aircraft and internal combustion engines are placing increasing demands on the electronics which play an increasingly important role in engine control. Complexity of control circuits has demanded increases in the scale of integration and in reliability, and have suggested the placement of high levels of functionality near the point of use. Engine performance must be evaluated with sensors and used intelligently to maintain optimum efficiency. Recent advances in microsensor technology have provided smaller, more economical sensors for these applications. With smaller sensors the need for signal conditioning electronics in close proximity to the sensor has become an increasingly important issue. The proposed three-phase project addresses the development of smart sensors for applications under high temperature ambients up to 350 C. The approach proposed here is the demonstration of the usefulness of the SOI material obtained by the Isolated Silicon Epitaxy ISE process for high temperature sensor applications. This would couple with process development of sensor elements.

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE