Microelectronic Device Reliability
Final rept. Aug 1986-Aug 1989
CLEMSON UNIV SC
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Research on pulsed current electromigration in fine-line VLSI metallization was performed. A test structure containing 6 sample lines was designed in accordance with NBS recommendations Ca. 1987 fabricated by an industrial firm and supplied to Clemson University for continued electromigration research.
- Electrical and Electronic Equipment