Accession Number:

ADA209142

Title:

Low Temperature Pulsed Plasma Deposition. Part 3. A Method of Deposition of Aluminum and Tin at Room Temperature

Descriptive Note:

Technical rept.

Corporate Author:

STC TECHNOLOGY LTD HARLOW (UNITED KINGDOM)

Report Date:

1989-05-23

Pagination or Media Count:

20.0

Abstract:

A method is described for the room temperature deposition of tin and aluminium films using the recently published pulsed plasma deposition technique. It is shown that high powered pulsed discharges of organometallics generally produce metal carbides, but by using pulsed discharges of hydrogen between the deposition pulses, virtually all the carbon in the film can be removed without requiring substrate heating. The technique is found to be capable of producing metal films at moderate deposition rates and of quality close to that of sputtered and evaporated films, but at temperatures close to room temperature. Results are presented on the conductivity of the films and practical applications for this technique are discussed.

Subject Categories:

  • Coatings, Colorants and Finishes
  • Fabrication Metallurgy

Distribution Statement:

APPROVED FOR PUBLIC RELEASE