Accession Number:

ADA207716

Title:

Multicomponent E-Beam Resists Containing Organometallic Compounds and Reactive Monomers

Descriptive Note:

Technical rept.

Corporate Author:

CORNELL UNIV ITHACA NY SCHOOL OF CHEMICAL ENGINEERING

Report Date:

1989-05-12

Pagination or Media Count:

14.0

Abstract:

Negative working resists with combined e beam sensitivity and oxygen etch resistance have been formulated by combining a host polymer for dimensional stability during radiation processing, an unsaturated, non-volatile monomeric component for control of sensitivity, and, an organometallic compound to contribute RIE resistance in an oxygen plasma. We have incorporated these three components into blends by three methods. Microlithography, Electron beam resist, Organometallic compounds, Reactive ion etching.

Subject Categories:

  • Physical Chemistry
  • Polymer Chemistry

Distribution Statement:

APPROVED FOR PUBLIC RELEASE