Forced-Convection, Liquid-Cooled, Microchannel Heat Sinks
MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB
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Water-cooled, microchannel heat sinks have been developed that can dissipate heat loads in excess of 1000 Wsq. cm with maximum surface temperatures 120 C. A theorectical model of microchannel heat sink thermal and fluid performance is presented. The model applies for small-, moderate-, and large-aspect-ratio channels, with fully developed and developing flow in the laminar and turbulent regimes. The channel surfaces may be smooth or roughened with repeated-ribs. Variable property effects have been included for the heat- sink material and the liquid coolant compressibility effects have not been included. A new computer program has been written to compute the thermal and fluid performance for a large variety of coolant-flow-rate constraints and heat-sink designs. A complete listing of this MICROHEX computer program is provided in this technical report. Thermal spreading at the perimeter of a surface heat source e.g., an integrated circuit is taken into account using simplified one-dimensional models. A novel concept of a Compensation Heater is presented that can enhance the temperature uniformity across IC heat sources. Procedures for fabricating microchannels in indium phosphide are presented. Indium phosphide microchannel heat sinks have been tested that have total thermal resistance as low as 0.072 CWsq. cm for a 0.25-cm square resistor heat source.
- Electrical and Electronic Equipment
- Air Conditioning, Heating, Lighting and Ventilating