Department of Defense Statement on the X-Ray Lithography Program,
OFFICE OF THE UNDER SECRETARY OF DEFENSE (ACQUISITION) RESEARCH AND ADVANCED T ECHNOLOGY WASHINGTON DC
Pagination or Media Count:
The Department has a broad and necessarily diverse program in semiconductor science and technology. The three principal goals of that effort are Reduce the gap between commercial integrated circuit usage and its deployment in military systems, assure a healthy on-shore industrial base to support our defense needs, enhance the producibility of specialized military semiconductor products. The major effort to achieve the first of these objectives is the Very High Speed Integrated Circuits VHSIC Program which is nearing completion. The Microwavemillimeter wave Monolithic Integrated Circuit MIMIC program has just completed a study program to define the product mix needed to meet military system requirements for radar, electronic warfare, smart weapons and telecommunications. We are bringing together the system requirements of all DoD with the device fabrication and product delivery capabilities of industry in an Infrared Focal Plane Array IRFPA program. The goal of the Software Initiative is to enhance our warfighting capability through development of efficient software generation technology and products plus the creation of a technology infusion infrastructure to couple the technology and products to system applications. The X-Ray Lithography Program will begin to establish the industrial base which will be required to sustain U.S. leadership in the semiconductor industry for the late 1990s.
- Electrical and Electronic Equipment