Correlation between Dielectric and Structural Properties during Epoxy Cure.
Technical rept. no. 10, Oct 86-Oct 87,
MASSACHUSETTS INST OF TECH CAMBRIDGE MICROSYSTEMS TECHNOLOGY LABS
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The relationship between the dielectric properties and the molecular structure of a commercial epoxy resin, Ciba-Geigys MY720, is reported. The ionic conductivity sigma was measured at several temperatures by microdielectrometry and correlated with the structural parameter, the glass transition temperature Tg, through a modified Williams Landel Ferry formulation where C1 is a constant and C2 and log sigmaTg are assumed to be a linear functions of Tg. Keywords Conductivity, Thermosetting polymers, Williams Landel Ferry equation, Glass transition temperature, Epoxy resins, Amine hardener, Network structure, Microdielectrometry, Differential scanning calorimetry, Loss factor.
- Physical Chemistry