Accession Number:

ADA190696

Title:

Correlation between Dielectric and Structural Properties during Epoxy Cure.

Descriptive Note:

Technical rept. no. 10, Oct 86-Oct 87,

Corporate Author:

MASSACHUSETTS INST OF TECH CAMBRIDGE MICROSYSTEMS TECHNOLOGY LABS

Report Date:

1987-11-01

Pagination or Media Count:

17.0

Abstract:

The relationship between the dielectric properties and the molecular structure of a commercial epoxy resin, Ciba-Geigys MY720, is reported. The ionic conductivity sigma was measured at several temperatures by microdielectrometry and correlated with the structural parameter, the glass transition temperature Tg, through a modified Williams Landel Ferry formulation where C1 is a constant and C2 and log sigmaTg are assumed to be a linear functions of Tg. Keywords Conductivity, Thermosetting polymers, Williams Landel Ferry equation, Glass transition temperature, Epoxy resins, Amine hardener, Network structure, Microdielectrometry, Differential scanning calorimetry, Loss factor.

Subject Categories:

  • Plastics
  • Physical Chemistry

Distribution Statement:

APPROVED FOR PUBLIC RELEASE