Accession Number:

ADA184167

Title:

Bond Character at a Silicon/Copper Surface.

Descriptive Note:

Technical rept.,

Corporate Author:

PENNSYLVANIA UNIV PHILADELPHIA DEPT OF PHYSICS

Report Date:

1986-12-01

Pagination or Media Count:

2.0

Abstract:

The ionic and covalent character of bonding is considered for the Si 111-5x5 Cu phase formed when one monolayer of copper is deposited on Si1117x7 and subsequently annealed to 600C. Localized orbitals and ab initio calculations have been employed to evaluate total energies and types of bonding for Cu adsorbed in several different sites, including the structure proposed by Chambers et al 1 on the basis of their angle resolved Auger electron spectroscopy results. The relation between the bond character of this phase and its surface spectroscopic properties is discussed.

Subject Categories:

  • Inorganic Chemistry

Distribution Statement:

APPROVED FOR PUBLIC RELEASE