Environmental Stress Screening Technology.
Final rept. Sep 83-Mar 85,
GRUMMAN AEROSPACE CORP BETHPAGE NY
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The objective of this study was to evaluate the feasibility of using infrared thermography for the detection and growth tracking of environmentally sensitive workmanship defects in printed circuit board assemblies. It was determined that the detection of defects, as manifested by power deviations as small as 15 milliwatts, is practical and feasible under static environmental conditions. Techniques for the use of infrared thermography under dynamic environmental conditions were also developed and evaluated. These techniques allowed the detection of intermittent as well as permanent failures. In all cases, the environmental stimulus was random vibration and rapid thermal cycling. The ability of infrared thermography to detect the growth of a defect was verified and determined to equate to power changes on the order of 5 milliwatts. The experimental results were sufficiently accurate and repeatable to warrant continued investigations into the development of a failure prediction method.
- Electrical and Electronic Equipment
- Test Facilities, Equipment and Methods
- Infrared Detection and Detectors