Dielectric Analysis of the Cure of Thermosetting Epoxy/Amine Systems.
Technical rept. no. 5, May 85-Aug 86,
MASSACHUSETTS INST OF TECH CAMBRIDGE MICROSYSTEMS TECHNOLOGY LABS
Pagination or Media Count:
The conductivity of seven epoxy resins of varying molecular weights were studied without hardener as a function of temperature. In addition, a low molecular weight resin was cured isothermally with an aromatic amine hardener and the conductivity was measured as a function of cure time. The conductivities of the resins without hardener obey a Williams-Landel-Ferry relation, and by incorporating a cure-dependent glass transition temperature into this relation, the observed behavior of the resin-plus-hardener system can be modeled.