Accession Number:

ADA171274

Title:

Dielectric Analysis of the Cure of Thermosetting Epoxy/Amine Systems.

Descriptive Note:

Technical rept. no. 5, May 85-Aug 86,

Corporate Author:

MASSACHUSETTS INST OF TECH CAMBRIDGE MICROSYSTEMS TECHNOLOGY LABS

Report Date:

1986-08-18

Pagination or Media Count:

11.0

Abstract:

The conductivity of seven epoxy resins of varying molecular weights were studied without hardener as a function of temperature. In addition, a low molecular weight resin was cured isothermally with an aromatic amine hardener and the conductivity was measured as a function of cure time. The conductivities of the resins without hardener obey a Williams-Landel-Ferry relation, and by incorporating a cure-dependent glass transition temperature into this relation, the observed behavior of the resin-plus-hardener system can be modeled.

Subject Categories:

  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE