Durability of Structural Adhesively Bonded Systems.
Final rept. Nov 84-Jan 86,
TECHNION RESEARCH AND DEVELOPMENT FOUNDATION LTD HAIFA (ISRAEL)
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An experimental and analytical study was conducted for quantitative evaluation of the interdependence of stress, strain, moisture diffusion and heat conduction in a polymeric adhesive-bonded layer as a function of time. Following experimental evaluation of the necessary coefficients, a set of nonlinear coupled differential equations is solved numerically by the finite strip method. It was shown that moisture diffusion coefficient correlates well with the volumetric changes in the stressed materials. Experimental data of the deformation behavior vs. moisture diffusion in an assymmetrical epoxy-aluminum model exposed to different hygrothermomechanical histories have shown a good correlation with analytical prediction. Author