Accession Number:

ADA170480

Title:

Modeling of Infiltration Kinetics and Interfacial Bond Strength in Aluminum Matrix-Silicon Carbide Somposites.

Descriptive Note:

Annual rept. 1 May 86-30 Apr 86,

Corporate Author:

COLORADO SCHOOL OF MINES GOLDEN CENTER FOR WELDING RESEARCH

Report Date:

1986-01-01

Pagination or Media Count:

33.0

Abstract:

The objective in this research is to gain a fundamental understanding of the wetting and adhesion of aluminum alloys to SiC. The preliminary approach has been to study the infiltration kinetics of molten aluminum alloys into green silicon carbide compacts and relate the results to the interfacial bond strength. Since both infiltration rate and interfacial bond strength are related to the interfacial tension at the interface, our approach has been to isolote those parameters which affect both infiltration kinetics i.e. viscosity, density, and pre size and interfacial bond strengthi.e. enthalpies of solution and electronic contributions and then to correlate the kinetics and bond strength to the most fundamental parameters. Author

Subject Categories:

  • Metallurgy and Metallography

Distribution Statement:

APPROVED FOR PUBLIC RELEASE