Accession Number:

ADA169388

Title:

1984 IR&D (Independent Research and Development) Advanced Packaging Study.

Descriptive Note:

Technical memo. 1984-1986,

Corporate Author:

JOHNS HOPKINS UNIV LAUREL MD APPLIED PHYSICS LAB

Personal Author(s):

• Clatterbaugh,G. V.
• Charles,H. C. , Jr

Report Date:

1986-06-01

Pagination or Media Count:

41.0

Abstract:

An advanced multiyear electronic packaging project has been started. The project is a comprehensive interactive one involving theory, modeling, structure fabrication, and reliability testing. Highlights of the first years activities are presented in this report. Important results include the creation of integrated thermal and thermomechanical models, the prediction of lifetimes under environmental and operational stress conditions, model verification and validation by carefully controlled experimentation, development of assembly techniques, and the invention of a new method for preparing controlled solder joint height and geometry. Keywords Electronic packaging VLSIVHSIC packaging Thermal analysis Thermal modeling Finite-element modeling thermomechanical analysis Chip carriers Solder reflow.

Descriptors:

• *INTEGRATED CIRCUITS
• *PACKAGING
• TEST AND EVALUATION
• STRESSES
• THERMAL PROPERTIES
• THERMOMECHANICS
• CONTROL
• PREDICTIONS
• VALIDATION
• MODELS
• STRUCTURAL PROPERTIES
• FINITE ELEMENT ANALYSIS
• ELECTRONIC EQUIPMENT
• CHIPS(ELECTRONICS)
• FABRICATION
• RELIABILITY
• THERMAL ANALYSIS
• FLOW
• ASSEMBLY
• LIFE SPAN(BIOLOGY)
• HEIGHT
• SOLDERING
• SOLDERED JOINTS

Subject Categories:

• Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE