The Electroplating of Laminated Chromium.
ARMY ARMAMENT RESEARCH DEVELOPMENT AND ENGINEERING CENTER WATERVLIET NY CLOSE COMBAT ARMAMENTS CENTER
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A microprocessor-controlled flow plating process was developed to deposit laminated chromium consisting of alternating layers of low contraction LC and high contraction HC chromium. The automated plating system contains a large number of variable parameters designed to allow the use of multiple plating modes. The available modes include a combination of direct current, interrupted, periodic reverse, pulse, and laminated chromium plating. The laminated plating experiments were conducted at LCHC solution temperatures of 85 and 55 C, current densities of 120 and 45 Adm sq, and at LCHC duty cycles to produce spacings between 0l01 and 2.7 micrometers. Under these plating conditions, deposits with hardness values between 655 and 1089 KHN and tensile strengths between 6.8 and 57.2 were obtained.
- Laminates and Composite Materials
- Metallurgy and Metallography
- Fabrication Metallurgy