Dielectric Analysis of Thermoset Cure.
Technical rept. no. 4, 1 May 84-7 Oct 85,
MASSACHUSETTS INST OF TECH CAMBRIDGE CENTER FOR MATERIALS SCIENCE AND ENGINEERING
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Measurements of dielectric properties have been used to monitor chemical reactions in organic materials for more than fifty years. This review addresses the application of dielectric measurements to thermosetting polymers including basic dielectric properties, the methods used to measure these properties, key experimental artifacts that must be understood by the investigator, the physical origin of those artifacts, and a survey of the current published literature with emphasis on the correlations between dielectric properties and other physical properties of the material. Keywords dielectric properties thermosetting polymers permittivity loss factor loss tangent conductivity resistivity epoxy resins polyimides polyesters phenolics ionic impurities dipole relaxation microdielectrometry Williams-Landel-Ferry equation WLF equation viscosity and cure.
- Electricity and Magnetism