Adherence and Bonding of the Ion Plated Films.
Final rept. Sep 79-Sep 82,
CAIRO UNIV (EGYPT) DEPT OF MECHANICAL DESIGN AND PRODUCTION
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Physical mechanisms taking place during the deposition process are discussed. Dominant factors such as the collision factors, ionization efficiency, average energy, and ion energy distribution are reported in detail. The mechanisms of ion-solid interactions, nucleation and atomistic mixing were experimentally investigated before adhesion testing and an evaluation is given. Some other characteristics of the ion plated coatings such as structural details, and mechanical and tribological properties are also included. The outstanding adhesion of the ion plated films was attributed to the 1 Atomically clean surfaces produced by sputter etching prior to and during film formation 2 Surface defects and mobile vacancies produced by ion-solid interactions 3 High energy ion entrapment as a result of the sputtering back of the low energy particles 4 Atomistic mixing of both the film and the substrate atoms 5 Gas scattering resulting in finer deposits 6 Thermally assisted diffusion Intermetallic compounds formed at the film substrate interface for the compatible metal pairs and 8 Extensive graded interfaces for incompatible metal pairs.
- Physical Chemistry
- Adhesives, Seals and Binders