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System Development Report for Automated Polymer Die Attach Machine.
Final rept. 21 Jan-18 Dec 81,
HUGHES AIRCRAFT CO TUCSON AZ TUCSON MFG DIV
Pagination or Media Count:
The current trend throughout the Military Hybrid Industry is the reduction of operator controlled variables in an effort to reduce cost while maintaining and increasing equipment volume handling capability. An important area in which this can be accomplished is in the chip to substrate assembly operation. Existing equipment is designed for operator recognition and orientation alignment of individual semiconductor chip topographies. The purpose of this manufacturing technology program has been to develop a semi-automatic chip recognition die bonding system. The system developed by this task presents a video image of the die to be placed on a TV Monitor. This image is overlayed with an outline image of the die to show correct orientation. The operator then aligns this overlayed image to the real die. At this point, the machine picks up, orients, and places the die in correct orientation on the substrate without operator control. THe system development activity in this task has been accomplished by Kulicke and Soffa Industries, Inc. with technical guidance provided by Hughes Aircraft. This report integrates that activity and is offered in three sections Section I - System Analysis Section II - Mechanical Design and Section III - Video Augmentation Design. Originator supplied keywords include Automatic die attachment Hybrids Polymer die attachment die recognition systems and Robotics.
APPROVED FOR PUBLIC RELEASE