Monitoring Cure of Epoxy Resins Using a Microdielectrometer.
Technical rept. no. 1, Feb 82-Jan 84,
WESTINGHOUSE RESEARCH AND DEVELOPMENT CENTER PITTSBURGH PA
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Microdielectrometry is a recent advancement in monitoring the cure of resins using dielectric techniques. It utilizes a solid state chip roughly .075 in. x .075 in. as the probe, and has on-chip amplification of the signal which permits interrogation of the material at frequencies as low as 1 Hz. This paper discusses cure monitoring of resins utilizing microdielectrometry and compares the technique and instrumentation to conventional dielectrometry. Data on an anhydride cured system and an aromatic amine cured system cured under isothermal and temperature variant conditions are presented. Results show that microdielectrometry can be used to follow cure of epoxy resins. Absolute measurements of permittivity and loss factor can be made and they provide information on the mechanisms that produce the observed changes. The present packaging of the chip is unsuitable for use with composites.
- Laminates and Composite Materials