Modeling and Extraction of Interconnect Parameters in Very-Large-Scale Integrated Circuits.
ILLINOIS UNIV AT URBANA COORDINATED SCIENCE LAB
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The increased complexity of the very large scale integrated circuits VLSI has greatly impacted the field of computer-aided design CAD. One of the problems brought about is the interconnection problem. In this research, the goal is two fold. First of all, a more accurate numerical method to evaluate the interconnect capacitance, including the coupling capacitance between interconnects and the fringing field capacitance, was investigated, and the integral method was employed. Two FORTRAN programs CAP2D and CAP3D based on this method were developed. Second, a PASCAL extraction program emphasizing the extraction of interconnect parameters was developed. It employs the cylindrical approximation formula for the self-capacitance of a single interconnect and other simple formulas for the coupling capacitances derived by a least square method. The extractor assumes only Manhattan geometry and NMOS technology. Four-dimensional binary search trees are used as the basic data structure. Author
- Electrical and Electronic Equipment
- Computer Programming and Software
- Solid State Physics