Electronic Packaging and Interconnect Technology Working Group Report (IDA/OSD R&M (Institute for Defense Analyses/Office of the Secretary of Defense Reliability and Maintainability Study).
Final rept. Jul 82-Aug 83,
INSTITUTE FOR DEFENSE ANALYSES ALEXANDRIA VA SCIENCE AND TECHNOLOGY DIV
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This document records the activities and presents the findings of the Electronic Packaging and Interconnect Technology Working Group part of the IDAOSD Reliability and Maintainability Study, conducted during the period from July 1982 through August 1983.
- Electrical and Electronic Equipment
- Logistics, Military Facilities and Supplies