Laser Photodeposition and Photoetching Study.
Progress rept. 1 Jan-31 Mar 83,
MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB
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Work during this quarter has developed a new technique for direct-write etching of Al and AlSiCu alloys, and has applied this new process to correction of bridging faults in VLSI signal-processing circuits. Additional work has expanded upon two excimer-laser resist processes to develop fast deep-UV lithographic procedures based on these powerful UV sources. A final series of experiments has extended pulsed UV-laser reactions to area photodeposition of Al203 films.
- Electrical and Electronic Equipment
- Lasers and Masers
- Solid State Physics