Restructurable VLSI Program
Semiannual technical summary rept. 1 Apr-30 Sep 1982
MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB
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The main objective of the Lincoln Restructurable VLSI Program RVLSI is to develop methodologies and architectures for implementing wafer-scale systems with complexities approaching a million gates. In our approach, we envisage a modular style of architecture comprising an array of cells embedded in a regular interconnection matrix. Ideally, the cells should consist of only a few basic types. The interconnection matrix is a fixed pattern of metal lines augmented by a complement of programmable switches or links. Conceptually, the links could be either volatile or nonvolatile. They could be of an electronic nature such as a transistor switch, or could be permanently programmed through some mechanism such as a laser. The RVLSI Program is currently focusing on laser-formed interconnect. The link concept offers the potential for a highly flexible, restructurable type of interconnect technology that could be exploited in a variety of ways. For example, logical cells or subsystems found to be faulty at wafer-probe time could be permanently excised from the rest of the wafer. The flexible interconnect could also be used to jump around faulty logic and tie in redundant cells judiciously scattered around the wafer for this purpose.
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