Accession Number:

ADA118714

Title:

Evaluation Selection of Encapsulating Plastics for Ordnance Electronic Assemblies

Descriptive Note:

Final rept. 8 Jan 1979-30 Apr 1980

Corporate Author:

HONEYWELL INC MINNETONKA MN DEFENSE SYSTEMS GROUP

Report Date:

1981-05-01

Pagination or Media Count:

123.0

Abstract:

A program was conducted to evaluate new plastics for encapsulating ordnance electronic circuits. Various candidate plastics including foams, syntactic resins, filled systems, semirigids, elastomers and molded thermoplastics and thermosets were evaluated through extensive mechanical and environmental tests followed by encapsulation of test circuits. Additionally, a relative cost comparison of the various material categories was conducted to identify and quantify cost drivers.

Subject Categories:

  • Electrical and Electronic Equipment
  • Coatings, Colorants and Finishes
  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE