Statistical Analysis of Accelerated Temperature Aging of Semiconductor Devices.
AEROSPACE CORP EL SEGUNDO CA ELECTRONICS RESEARCH LAB
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Although accelerated temperature stressing of semiconductor devices is an accepted and widely employed technique for assessing the reliability of semiconductor devices, it appears that a statistical error analysis of this procedure is not available. The purpose of this work is to partially remedy this deficiency. The goal of this program is easily stated A number of devices taken from a distribution are operated at several elevated temperatures to induce failure in all devices within a reasonable time. Assuming general characteristics of the device failure probability density function pdf and its temperature-dependence, we estimate the expected cumulative failure function cff for devices in normal operation. By estimated cff, we mean our best estimate, based on statistical inference, of the average probability of random device taken from the same distribution but operated at a normal temperature failing as a function of time. Section II contains a brief review of the general mathematical formalism usually employed in semiconductor reliability discussions.
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