Accession Number:

ADA099418

Title:

Cure Monitoring Techniques for Adhesive Bonding Techniques.

Descriptive Note:

Final rept. 1 May 79-Sep 80,

Corporate Author:

LOCKHEED MISSILES AND SPACE CO INC SUNNYVALE CA MISSILES SYSTEMS DIV

Report Date:

1980-11-01

Pagination or Media Count:

116.0

Abstract:

As a result of the work reported herein a foundation has been developed for automated bonding cycle control. The monitoring system was improved through the development of a mathematical model which affords a theoretical understanding of the dielectric signals and permits their chemorheological interpretation. The mechanical reliability of the probe was improved to minimize in-process failures. It was demonstrated that the shape of the dielectric curve was dependent on the chemical composition of the adhesive and was a useful tool for the optimization of cure cycles. Environmental testing of joints containing probes indicated that combinations of moist environments and elevated temperatures caused a degradation of bond performance. However, surface treatments can be applied to the probe without destroying the dielectric monitoring capability and should be evaluated as a solution to this problem. Evidence was also developed that it may be feasible to use the probe to detect the ingress of moisture into a bonded joint. Author

Subject Categories:

  • Polymer Chemistry
  • Plastics
  • Computer Hardware

Distribution Statement:

APPROVED FOR PUBLIC RELEASE