Microdielectrometry: A New Method for In Situ Cure Monitoring.
Technical rept. no. 2, Sep 79-Dec 80,
MASSACHUSETTS INST OF TECH CAMBRIDGE CENTER FOR MATERIALS SCIENCE AND ENGINEERING
Pagination or Media Count:
Integrated circuit technology has been used to develop a miniature dielectric cure monitor probe that combines small size with built in amplification to achieve good sensitivity down to 1 Hz, making the probe more sensitive to physical property changes than conventional dielectrometers operating at 1000 Hz. This paper describes the design and operation of the microdielectrometer chip, and the model used to determine the complex dielectric constant of the material under study. Two typical applications are illustrated by experiments. First, results of a postcure study of a Versamide 140, Epon 828 mixture are presented and compared to the results of a similar study using a conventional parallel plate capacitor. In a second experiment, several probes were placed in a 100 ml mold and used to monitor the cure of a sample of the same resin system. The data show the nonuniformity of cure within the sample, and can be explained on the basis of gelation and the temperature dependence of the dielectric properties as determined in the post-cure experiment. Author
- Electrical and Electronic Equipment
- Test Facilities, Equipment and Methods