Accession Number:

ADA091071

Title:

Encapsulation of Electronic Subassemblies with Thermosetting Resins. Part I,

Descriptive Note:

Corporate Author:

FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OH

Personal Author(s):

Report Date:

1980-09-22

Pagination or Media Count:

29.0

Abstract:

Subject Categories:

  • Electrical and Electronic Equipment
  • Plastics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE