Accession Number:

ADA089744

Title:

Electronics Temperature Control,

Descriptive Note:

Corporate Author:

BOEING CO SEATTLE WA

Personal Author(s):

• Pogson,J. T.

Report Date:

1975-01-01

Pagination or Media Count:

65.0

Abstract:

The results of a preliminary study on thermal modeling and analysis of microcircuits are presented. Studies covering typical components mounting methods, bonding agent materials component spacing, and cooling concepts are described. Temperature profiles of substrates, component temperatures and thermal resistances are presented. It is shown that the use of moly tabs, sputtered beryllia and thermoelectric coolers can significantly reduce component temperature levels. Additionally, it is illustrated that thermal modeling can aid the circuit designer in the layout and preliminary design phases. Author

Descriptors:

• *ELECTRONICS
• *COOLING
• *TEMPERATURE CONTROL
• *MICROCIRCUITS
• MODELS
• SUBSTRATES
• PROFILES
• THERMAL ANALYSIS
• COOLING AND VENTILATING EQUIPMENT
• THERMAL RESISTANCE
• ADHESIVE BONDING
• CURVES(GEOMETRY)
• THERMOELECTRIC COOLING

Subject Categories:

• Electrical and Electronic Equipment
• Air Conditioning, Heating, Lighting and Ventilating

Distribution Statement:

APPROVED FOR PUBLIC RELEASE