Accession Number:

ADA083920

Title:

Interactive Effects of Bond Wires Used for Microwave Semiconductor Device Combining and Matching Circuitry.

Descriptive Note:

Interim rept.,

Corporate Author:

NAVAL RESEARCH LAB WASHINGTON DC

Report Date:

1980-03-05

Pagination or Media Count:

11.0

Abstract:

For arrays of bond wires, inter-wire coupling can significantly affect the parameters of the individual wires. Design information is given for two port problems consisting of multiple bond wire arrays over a ground plane. Secondly, bond wire coupling can degrade the combining efficiency of several wire-combined solid state devices such as transistor unit cells. This problem is modeled and analyzed, and remedies are suggested. Author

Subject Categories:

  • Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE