Interactive Effects of Bond Wires Used for Microwave Semiconductor Device Combining and Matching Circuitry.
NAVAL RESEARCH LAB WASHINGTON DC
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For arrays of bond wires, inter-wire coupling can significantly affect the parameters of the individual wires. Design information is given for two port problems consisting of multiple bond wire arrays over a ground plane. Secondly, bond wire coupling can degrade the combining efficiency of several wire-combined solid state devices such as transistor unit cells. This problem is modeled and analyzed, and remedies are suggested. Author
- Electrical and Electronic Equipment