Methods for Manufacturing Heat Pipes for Circuit Cards.
Final rept. 30 Sep 77-31 Mar 79,
HUGHES AIRCRAFT CO FULLERTON CA GROUND SYSTEMS GROUP
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Manufacturing processes to fabricate heat pipes for circuit cards were evaluated. These included shell and wick fabrication, shell and wick joining, and vacuumfill and testing. Cost effective processes were selected to meet production requirements. A production facility was designed based on cost trade-offs. The results of the evaluation, selection of recommended manufacturing methods and the design of the production facility are presented. Author
- Electrical and Electronic Equipment