Accession Number:

ADA071149

Title:

The Effects of Substrate Composition on Thick Film Circuit Reliabilty.

Descriptive Note:

Quarterly rept. no. 1, 2 Jan-30 Apr 79,

Corporate Author:

PURDUE UNIV LAFAYETTE IN TURNER LAB FOR ELECTROCERAMICS

Personal Author(s):

Report Date:

1979-05-31

Pagination or Media Count:

22.0

Abstract:

The high temperature surface tensions and viscosities of thick film glasses were measured as a funcion of temperature and the amount of AlSiMag 614 substrate dissolved in the glasses. The magnitude of the surface tension was observed to increase and the temperature coefficient of surface tension to decrease as the amount of dissolved substrate was increased. The ripening of RuO2 particles in thick film glasses was measured as a function of temperature and the amount of AlSiMag 614 substrate dissolved in the glasses. The ripening kinetics in all glass compositions were in agreement with a phase boundary reaction rate limiting step, and the rate constant was observed to decrease by a factor of 4 when the amount of dissolved substrate reached 10 weight percent. Author

Subject Categories:

  • Electrical and Electronic Equipment
  • Ceramics, Refractories and Glass

Distribution Statement:

APPROVED FOR PUBLIC RELEASE