Accession Number:

ADA065566

Title:

Photolithographic Techniques for Surface Acoustic Wave (SAW) Devices. Volume 2. Technical and Operational Parts 1 and 2.

Descriptive Note:

Final rept. 1 Jul 75-31 Dec 78,

Corporate Author:

HUGHES AIRCRAFT CO FULLERTON CALIF GROUND SYSTEMS GROUP

Personal Author(s):

Report Date:

1978-12-01

Pagination or Media Count:

127.0

Abstract:

The object of the program was the establishment of a production capability for surface acoustic wave devices of varied design and material for the purpose of meeting estimated military needs for a period of two years after the completion of the contract, and to establish a base and plans which may be used to meet expanded requirements. The primary requirements was the pilot line production of devices that are reliable, reproducible, and low cost. The first phase of this program required the design, fabrication and testing of a total of 60 prototype bandpass, tapped delay line and pulse compression SAW filters on both lithium niobate and ST-quartz. The First Engineering Phase Phase I clerical testing demonstrated that the device designs generally met the specifications imposed by the program. Deviations from specification, which required additional test to optimize the levels of padding andor shunt resistance and capacitance, were resolved during the Second Engineering Phase Phase II for the PC-Q, PC-LN and TDL-200. Deviations from the insertion loss specification occurred with the BP-LN and TDL-100 designs. In the former case, a redesign excluding the program-specified multi-strip coupler, was theoretically evaluated. In the latter case, as pointed out in the Hughes proposal, a theoretical analysis precluded the possibility of a specification accommodation. It was necessary to revise the specification for both designs since the customer insisted on utilization of the multistrip coupler in the BP-LN.

Subject Categories:

  • Line, Surface and Bulk Acoustic Wave Devices
  • Fabrication Metallurgy
  • Acoustics

Distribution Statement:

APPROVED FOR PUBLIC RELEASE