Accession Number:

ADA063782

Title:

The Effects of Substrate Composition on Thick Film Circuit Reliability.

Descriptive Note:

Quarterly rept. no. 3, 1 Aug-31 Oct 78,

Corporate Author:

PURDUE UNIV LAFAYETTE IN TURNER LAB FOR ELECTROCERAMICS

Personal Author(s):

• Vest,R. W.

Report Date:

1978-11-30

Pagination or Media Count:

42.0

Abstract:

The sheet resistance, temperature dependence of the resistance, and the current noise were measured for thick film resistors as a function of the amount of alumina substrate dissolved in the resistor glass for resistor firing times from 4 to 22 minutes at 800 C. Large variations in these three properties were observed, and the changes were qualitatively correlated with changes in viscosity of the glass. The microstructure development and charge transport model used to correlate the results involves changing proportions of sintered and non-sintered contacts in the RuO2 networks within the body of the resistors. The solubility of RuO2 in the resistor glass was determined as a function of temperature and amount of substrate dissolved in the glass, and the kinetics of substrate dissolution were measured under varying processing conditions. Preliminary results on MIM devices fabricated with resistor glasses are presented. Author

Descriptors:

• *SUBSTRATES
• *ELECTRICAL RESISTANCE
• *THICK FILMS
• *RESISTORS
• GLASS
• OXIDES
• ALUMINUM OXIDES
• CIRCUITS
• SOLUBILITY
• TEMPERATURE COEFFICIENTS
• DISSOLVING
• SINTERING
• RUTHENIUM COMPOUNDS

Subject Categories:

• Electrical and Electronic Equipment

Distribution Statement:

APPROVED FOR PUBLIC RELEASE