Modular Avionics Packaging (MAP).
GENERAL ELECTRIC CO UTICA N Y AIRCRAFT EQUIPMENT DIV
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In considering Modular Avionics Packaging, the objective of the General Electric study program was to develop an avionics equipment packaging concept, compatible with MIL-E-5400, and applicable to multiplatform avionics requirements stretching into the 1990s. Specific elements evaluated were Standard Avionics Module SAM requirements and concepts integrated racks and WRA requirements and concepts and airframe interface considerations. The VSTOL Type A platform was used as the driving requirement in performing trade-off studies. Key design objectives and constraints included the following Minimizing installed avionics weight and volume Mechanical simplicity Significant improvement in Reliability and Maintainability Eliminating single-point failure modes Direct access to Weapons Replaceable Modules WRM Modules capable of being conduction-cooled Significant improvement in thermal performance and Improved testability at all hardware levels.
- Electrical and Electronic Equipment