Manufacturing Methods and Technology Engineering for Tape Chip Carrier.
Quarterly Rept. no. 1, 1 Jan-31 Mar 78,
HONEYWELL INC ST PETERSBURG FL AVIONICS DIV
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The contract is aimed at establishing and demonstrating the feasibility of an automated assembly line for hybrid microcircuits using tape chip carrier technology for semiconductor devices whenever practical. The automated line will also make use of automatic substrate handling equipment to move partially assembled devices in and out of magazines.
- Electrical and Electronic Equipment
- Manufacturing and Industrial Engineering and Control of Production Systems
- Machinery and Tools